SpaceCube 2.0 Flight Card Mechanical System
SpaceCube 2.0 Flight Card Mechanical System (GSC-TOPS-227)
Mechanical system designed to accommodate various uses of SpaceCube 2.0, the on-board hybrid science data processing system
SpaceCube 2.0 is a family of high-performance reconfigurable systems designed for spaceflight applications requiring on-board processing. The environmental requirements of the SpaceCube 2.0 system do not meet the available design practices seen currently in the spaceflight industry. There is a need for a mechanical space flight system that both meets Space Cube 2.0s environmental requirements and standard flight design rules for board design and assembly features. There is also a need for a mechanical design that is adaptable for multiple SpaceCube 2.0 use cases and mission environments. This is for schedule, costs, and performance resources to be utilized efficiently. Additionally, a mechanical system is needed that meets environmental requirements in a passive manner to ensure the mechanical assemblies are assembled in a cost and schedule efficient manner. The SpaceCube 2.0 Flight Card Mechanical System meets SpaceCube 2.0s environmental requirements and meets standard flight design rules.
The SpaceCube 2.0 Flight Card Mechanical System is inherently adaptable and configurable for various configurations. The mechanical system also enables the processor and power card assemblies to meet standard, thermal, structural, electromagnetic interference, and radiation environmental requirements. The design includes a primary and optional secondary side stiffening frame. The frames bolt to the printed circuit card in a back-to-back, mirror-image configuration. The frames include interface locations to mount a front panel where the signal and power connectors interface to external systems. The top of the frames has interface locations for mounting a custom shield. The primary side frame has a flange interface next to the card guide which allows for the processor and power card assemblies to be inserted and extracted from the overall SpaceCube 2.0 system. The flange also enables thermal and mechanical coupling of the processor and power card to the mechanical house of the SpaceCube 2.0 system. The SpaceCube 2.0 Flight Card Mechanical Systems frame adapts for multiple thermal and structural use cases while modifying a very little portion of its overall design. The use of the frame, its thermal design implementations, and structural assembly processes allows back-to-back 1mm pitch devices and large back-to-back power converter devices to survive environmental requirements. The mechanical system design supports high power and high mass density on an electronics board assembly. Additionally, the top side of the heat frame adapts for various thermal design implementations.
- Survives stringent environmental requirements
- Reliable and robust design
- Allows efficient use of cost, schedule, mass, and power consumption resources
- Mechanical aerospace manufacturing
- Thermal structure manufacturing