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One inner insulative layer, and one outer robust ablative layer comprise the AMTPS technology. When applying the heat shield to the surface of a spacecraft, the insulative layer is printed first and primarily functions to reduce the amount of heat soak into the vehicle. The formulation of the insulative layer has a slightly lower density (as compared to the robust layer) and is adjusted using a differing constituent ratio of phenolic and/or glass microballoon material. Both formulations combine a phenolic resin with various fillers to control pre- and post-cure properties that can be adjusted by varying the carbon and/or glass fiber content along with rheology modifiers to enhance the fluid flow for deposition systems. The robust layer is applied next and functions as the ablative layer that ablates away or vaporizes when subjected to extremely high temperatures such as those achieved during atmospheric entry. The formulation of the robust layer produces a gas layer as it vaporizes in the extreme heat that acts as a boundary layer. This boundary prevents heat from further penetrating the remaining robust material by pushing away the even hotter shock layer. The shock layer is a region of super-heated compressed gas, positioned in front of the Earth-facing bottom of the spacecraft during atmospheric entry, that results from the supersonic shockwave generated. Commercial space applications for this AMTPS technology include use on any spacecraft that transits a planetary or lunar atmosphere such as Mars or Saturn’s moon Titan. Additionally, the invention may be useful for launch system rockets to provide heat shielding from atmospheric reentry or to protect ground equipment on the launch pad from rocket exhaust plumes. As the number of government and commercial space missions to primary Earth orbits, the Moon, and the Solar System increase, there will be a growing need for cost-effective, on-demand, and timely fabrication of heat shields for space-related activities. AMTPS Formulations – Insulative and Robust Variation is at a technology readiness level (TRL) 5 (component and/or breadboard validation in laboratory environment) and is now available for patent licensing. Please note that NASA does not manufacture products itself for commercial sale.

Going farther, faster and hotter in space means innovating how NASA constructs the materials used for heat shields. For HEEET, this results in the use of dual-layer, three-dimensional, woven materials capable of reducing entry loads and lowering the mass of heat shields by up to 40%. The outer layer, exposed to a harsh environment during atmospheric entry, consists of a fine, dense weave using carbon yarns. The inner layer is a low-density, thermally insulating weave consisting of a special yarn that blends together carbon and flame-resistant phenolic materials. Heat shield designers can adjust the thickness of the inner layer to keep temperatures low enough to protect against the extreme heat of entering an atmosphere, allowing the heat shield to be bonded onto the structure of the spacecraft itself. The outer and inner layers are woven together in three dimensions, mechanically interlocking them so they cannot come apart. To create this material, manufacturers employ a 3-D weaving process that is similar to that used to weave a 2-D cloth or a rug. For HEEET, computer-controlled looms precisely place the yarns to make this kind of complex three-dimensional weave possible. The materials are woven into flat panels that are formed to fit the shape of the capsule forebody. Then the panels are infused with a low-density version of phenolic material that holds the yarns together and fills the space between them in the weave, resulting in a sturdy final structure. As the size of each finished piece of HEEET material is limited by the size of the loom used to weave the material, the HEEET heat shield is made out of a series of tiles. At the points where each tile connects, the gaps are filled through inventive designs to bond the tiles together.