Atomic Layer Deposition-Enhanced Far-to-Mid Infrared Camera Coating

These materials, which are composed of highly optically transmissive materials, are engineered to provide near-perfect reflection of the full solar spectrum in space. The materials are finely divided such that they scatter and reflect the incoming radiation from the UV down into the mid-IR and are also coated in some fashion with silver to extend the reflectance down into the far IR region of the solar spectrum. With this near-perfect reflectance of the complete solar spectrum, the scientists envision use of these materials for maintaining cryogenic temperatures for extended periods of time in space. The materials have also been developed into highly flexible, moisture resistant selective surface paint.The use and storage of cryogenics fluids is critical to many space operations, and while there are thermal control coatings in use today for spacecraft, none can provide this near-perfect reflection required for long-term maintenance of cryogenic temperatures.

This new technology applies NASA engineering to a FLIR Systems Boson® Model No. 640 to enable a robust IR camera for use in space and other extreme applications. Enhancements to the standard Boson® platform include a ruggedized housing, connector, and interface. The Boson® is a COTS small, uncooled, IR camera based on microbolometer technology and operates in the long-wave infrared (LWIR) portion of the IR spectrum. It is available with several lens configurations. NASA's modifications allow the IR camera to survive launch conditions and improve heat removal for space-based (vacuum) operation. The design includes a custom housing to secure the camera core along with a lens clamp to maintain a tight lens-core connection during high vibration launch conditions. The housing also provides additional conductive cooling for the camera components allowing operation in a vacuum environment. A custom printed circuit board (PCB) in the housing allows for a USB connection using a military standard (MIL-STD) miniaturized locking connector instead of the standard USB type C connector. The system maintains the USB standard protocol for easy compatibility and "plug-and-play" operation.

Fabrication of NASA's pupil mask begins with the preparation of a silicon wafer, which serves as the foundation for the black silicon structure. The wafer undergoes ion beam figuring (IBF), a non-contact technique that precisely removes surface irregularities at the nanometer scale. This process ensures that the silicon surface is diffraction-limited, eliminating errors that could degrade optical performance. Once the wafer is polished to the required precision, it is then processed lithographically to define the mask pattern, creating reflective and absorptive regions essential for controlling light propagation. To achieve the desired high absorption characteristics, the lithographically patterned wafer undergoes cryogenic etching, a sophisticated process that transforms the silicon surface into a highly textured, black silicon structure. This method utilizes a controlled plasma environment with sulfur hexafluoride (SF6) and oxygen to etch the surface at cryogenic temperatures. The process is carefully optimized by adjusting parameters such as gas flow rates, chamber pressure, ion density, and etch duration, leading to the formation of high-aspect-ratio nanostructures on the silicon substrate. These structures, resembling a dense “forest” of silicon nanospikes, trap and diffuse incoming light, drastically reducing specular reflection. The resulting surface exhibits an ultra-low reflectivity that is orders of magnitude lower than conventional polished silicon. By leveraging NASA’s cutting-edge fabrication technique, the newly developed black silicon pupil mask offers a powerful solution for high-contrast astronomical imaging. Its ability to minimize scattered light and enhance optical contrast makes it an ideal component for space telescopes tasked with directly imaging exoplanets as well as other applications requiring ultra low reflectivity systems.

The thin film sensor’s principal advantage lies in its potential to take high frequency temperature measurements from the surface of a reentering spacecraft while simultaneously withstanding the high temperature and oxidizing environment encountered. This data provides engineers with operational phase measurements used to refine the spacecraft’s operational envelope and track flight hardware behavior in addition to providing high frequency temperature measurements that can inform the physics of a boundary layer. Mismatches in coefficients of thermal expansion (CTE) are expected in TPS-based sensor applications because the metallic materials used for temperature sensing have thermal expansion rates that differ from the rates of the substrate and coating materials in the TPS. At high temperatures during reentry, this mismatch in CTE can create a significant strain differential between the metallic sensor, sensor leads, and the materials to which the sensor and leads are bonded. High frequency response temperature measurements on the surface of entry spacecraft are not currently possible above ~700 F with existing measurement capabilities. This shortcoming is primarily due to the need for robust sensor behavior at temperatures of several thousand degrees F. The sensor design of this technology preserves the integrity of sensor components while enhancing its high temperature functionality. The thin film temperature sensor has a technology readiness level (TRL) 5 (Component and/or breadboard validation in relevant environment) and is now available for patent licensing. Please note that NASA does not manufacture products itself for commercial sale.

This innovative NASA process begins with the deposition of an Al layer onto an optically smooth glass substrate using a high-vacuum PVD system. Unlike conventional methods where the Al surface is immediately exposed to air or coated with LiF, this new technique entails an initial exposure of the fresh Al film to XeF2 gas. This step chemically passivates the Al surface, forming a thin (~2.5-3.2 nm) protective layer of aluminum fluoride (AlF3). This barrier prevents oxidation and contamination of the aluminum before the LiF layer is applied, preserving its reflectivity. Following the XeF2 treatment, a flash-evaporated LiF overcoat is deposited onto the Al surface using a conventional PVD process. Deposition is performed at a high rate to increase the density of the LiF layer, enhancing its environmental stability and optical performance. Immediately after the LiF deposition, the mirror undergoes a second XeF2 exposure, further passivating the surface. This dual XeF2 treatment is key to the improved durability of the mirrors, as it effectively seals the interfaces and prevents degradation over time. One of the most significant advantages of this process is that it is performed entirely at room temperature, eliminating the need for high-temperature deposition techniques conventionally used for such coatings. Extensive testing of these new mirrors has demonstrated their performance and durability. Testing of prototypes optimized for 121.6 nm demonstrated 92.6% reflectivity, surpassing all previously reported values for Al/LiF coatings. Long-term environmental testing has shown that these mirrors maintain their high reflectance even after months of storage in moderate humidity conditions. Further stress testing in environments with 50-60% humidity for three weeks resulted in a reflectance reduction of about 2%, demonstrating high environmental stability. This NASA invention is available for patent licensing to industry.