Atomic Layer Deposition-Enhanced Far-to-Mid Infrared Camera Coating

These materials, which are composed of highly optically transmissive materials, are engineered to provide near-perfect reflection of the full solar spectrum in space. The materials are finely divided such that they scatter and reflect the incoming radiation from the UV down into the mid-IR and are also coated in some fashion with silver to extend the reflectance down into the far IR region of the solar spectrum. With this near-perfect reflectance of the complete solar spectrum, the scientists envision use of these materials for maintaining cryogenic temperatures for extended periods of time in space. The materials have also been developed into highly flexible, moisture resistant selective surface paint.The use and storage of cryogenics fluids is critical to many space operations, and while there are thermal control coatings in use today for spacecraft, none can provide this near-perfect reflection required for long-term maintenance of cryogenic temperatures.

This new technology applies NASA engineering to a FLIR Systems Boson® Model No. 640 to enable a robust IR camera for use in space and other extreme applications. Enhancements to the standard Boson® platform include a ruggedized housing, connector, and interface. The Boson® is a COTS small, uncooled, IR camera based on microbolometer technology and operates in the long-wave infrared (LWIR) portion of the IR spectrum. It is available with several lens configurations. NASA's modifications allow the IR camera to survive launch conditions and improve heat removal for space-based (vacuum) operation. The design includes a custom housing to secure the camera core along with a lens clamp to maintain a tight lens-core connection during high vibration launch conditions. The housing also provides additional conductive cooling for the camera components allowing operation in a vacuum environment. A custom printed circuit board (PCB) in the housing allows for a USB connection using a military standard (MIL-STD) miniaturized locking connector instead of the standard USB type C connector. The system maintains the USB standard protocol for easy compatibility and "plug-and-play" operation.

NASA’s innovative passivation process consists of exposing in-situ Physical Vapor Deposited oxide-free AI samples in a high or ultra-high vacuum chamber at ambient temperature to a low-pressure reactive gas of xenon difluoride (XeF2) immediately after depositing the AI layer. In this chemisorption process, the XeF2 is adsorbed on the surface of the AI layer, and due to the affinity of Al to fluorine molecules, the weakly-bound Xe dissociates and is pumped out of the chamber. A thin AlF3 overcoat layer is produced as a result. Other embodiments of the invention include the use of alternative processing gasses for the passivation treatment, or the utilization of a plasma source to increase the ion/atom ratio of the incident fluorine species resulting after XeF2 dissociation. Similarly, different mirror substrates materials with suitable surface characteristics in the FUV could be employed. In addition to the improved FUV reflectance, environmental stability, and maintained efficiency at higher wavelengths of the resulting Al mirrors, this NASA process has several unique features. Firstly, the entire process is carried out at ambient temperature, eliminating the need for high-temperature fluoride deposition. Secondly, the process is highly scalable, limited only by the size of the coating chamber where the passivation of XeF2 is carried out. Finally, the process can be manipulated to conform to any geometry, enabling its use for curved optics. While NASA originally developed the passivation of oxide-free aluminum coatings to realize reflectivity enhancement in the Far-Ultraviolet for the Large UV/Optical/IR Surveyor (LUVOIR), it may also be useful to companies that manufacture ground-based or space-based optical systems with sensitivity to the FUV spectrum. Examples include optics for space telescopes with reflective elements, vacuum-ultraviolet (VUV) plasma analysis tools, photolithography instrumentation, and wafer inspection tools.

Fabrication of NASA's pupil mask begins with the preparation of a silicon wafer, which serves as the foundation for the black silicon structure. The wafer undergoes ion beam figuring (IBF), a non-contact technique that precisely removes surface irregularities at the nanometer scale. This process ensures that the silicon surface is diffraction-limited, eliminating errors that could degrade optical performance. Once the wafer is polished to the required precision, it is then processed lithographically to define the mask pattern, creating reflective and absorptive regions essential for controlling light propagation. To achieve the desired high absorption characteristics, the lithographically patterned wafer undergoes cryogenic etching, a sophisticated process that transforms the silicon surface into a highly textured, black silicon structure. This method utilizes a controlled plasma environment with sulfur hexafluoride (SF6) and oxygen to etch the surface at cryogenic temperatures. The process is carefully optimized by adjusting parameters such as gas flow rates, chamber pressure, ion density, and etch duration, leading to the formation of high-aspect-ratio nanostructures on the silicon substrate. These structures, resembling a dense “forest” of silicon nanospikes, trap and diffuse incoming light, drastically reducing specular reflection. The resulting surface exhibits an ultra-low reflectivity that is orders of magnitude lower than conventional polished silicon. By leveraging NASA’s cutting-edge fabrication technique, the newly developed black silicon pupil mask offers a powerful solution for high-contrast astronomical imaging. Its ability to minimize scattered light and enhance optical contrast makes it an ideal component for space telescopes tasked with directly imaging exoplanets as well as other applications requiring ultra low reflectivity systems.

The thin film sensor’s principal advantage lies in its potential to take high frequency temperature measurements from the surface of a reentering spacecraft while simultaneously withstanding the high temperature and oxidizing environment encountered. This data provides engineers with operational phase measurements used to refine the spacecraft’s operational envelope and track flight hardware behavior in addition to providing high frequency temperature measurements that can inform the physics of a boundary layer. Mismatches in coefficients of thermal expansion (CTE) are expected in TPS-based sensor applications because the metallic materials used for temperature sensing have thermal expansion rates that differ from the rates of the substrate and coating materials in the TPS. At high temperatures during reentry, this mismatch in CTE can create a significant strain differential between the metallic sensor, sensor leads, and the materials to which the sensor and leads are bonded. High frequency response temperature measurements on the surface of entry spacecraft are not currently possible above ~700 F with existing measurement capabilities. This shortcoming is primarily due to the need for robust sensor behavior at temperatures of several thousand degrees F. The sensor design of this technology preserves the integrity of sensor components while enhancing its high temperature functionality. The thin film temperature sensor has a technology readiness level (TRL) 5 (Component and/or breadboard validation in relevant environment) and is now available for patent licensing. Please note that NASA does not manufacture products itself for commercial sale.