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TSNA-C is a nickel-based disk alloy designed around the familiar gamma/gamma-prime superalloy microstructure, but augmented by local phase transformation (LPT) strengthening that activates under creep. During high-temperature service, specific superlattice stacking faults become sites for controlled atomic-scale transformations, which harden those faults, suppress shear pathways (including microtwinning), and slow the mechanisms that typically degrade lifespan due to creep. This fault-level reinforcement is paired with a commercial-ready composition window tuned to balance transformation strengthening with forgeability and heat-treat response, enabling integration into powder-metallurgy routes such as Hot Isostatic Pressing, forging, and standard thermal processing. In NASA development, TSNA alloys formed the expected gamma/gamma-prime microstructure and preliminary tensile and fatigue-crack-growth evaluations at elevated temperature were within acceptable ranges for disk materials. Additionally, phase-stability checks after long-duration exposures showed no deleterious topologically close-packed (TCP) phase formation. Together, properties provide a disk alloy that can sustain higher hot-section demands with a balanced property profile, while fitting the workflows and cost expectations familiar to engine OEMs and suppliers. Forged variants demonstrated markedly improved high-temperature creep behavior, motivating a commercial composition that balances processability with fault-level strengthening. This technology is assessed at a Technology Readiness Level (TRL) 5 and is available for patent licensing.