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The novel mixer offers wideband and sub-harmonic conversion capabilities for enhanced signal processing across a broad frequency range. The mixer operates at 470-600 GHz and includes a LO waveguide to allow 265-300 GHz input signal and a radio frequency (RF) waveguide for the 470-600 GHz operation. The LO and RF signal multiply and down-convert the RF signal to an IF signal to a much lower frequencies for further digitization. The mixer is designed on a gold and quartz substrate for a lower dielectric constant. The filter design uses a triangular patch resonator-based low-pass filter to reduce the size of the mixer as well as isolates the LO signal and the wide IF signal. Additionally, an IF filter, RF filter, Schottky diode, LO, and RF probes are integrated into a single chip to further reduce the dimensions of the mixer. The invention also leverages an antiparallel diode orientation, where the LO frequency is half of the RF input. This LO signal is amplified and multiplied up to 265-300 GHz to provide an input power of 3-5 mW to pump the antiparallel mixer. The technology offers significant advantages in remote sensing and high-speed communications, enabling simultaneous detection of multiple molecular species and enhancing the efficiency of submillimeter-wave heterodyne spectrometers. The wideband functionality achieves high data rates required in emerging 6G networks and offers exceptional sensitivity, with prototype tests showing a conversion loss below 12 dB and noise temperatures under 4000 K at 470 GHz. The integration of components such as filters and diodes into a single chip reduces system size and complexity, contrasting with traditional multi-chip setups. The design is scalable across frequencies from 1 GHz-1 THz with minimal modifications, with the system's form factor inversely scaling with frequency. These features make the technology versatile for applications in environmental monitoring, planetary exploration, radar systems, and advanced communication systems.

NASA's ODS-MEA maintains properties up to 1100°C and is not susceptible to deleterious phase changes when exposed to extreme temperatures, an issue ubiquitous to Ni- based superalloys such as Inconel-625 and Inconel-718. Yttria particles are dispersed throughout the alloy to maximize strength and creep resistance at high temperatures using a novel fabrication technique. This technique employs an acoustic mixer to stir nano-scale Yttria oxide powder within a metallic matrix powder, creating a film of Yttria surrounding the larger metallic powder particles. Solid components are then produced from this mixture via SLM, during which the laser disperses the Yttria particles throughout the microstructure. Ultimately, the process eliminates the many expensive and time-consuming steps in the production of ODS alloys via traditional mechanical alloying. NASA's process has been shown to fabricate components with 10x improvement in creep rupture life at 1100°C and provides a 30% increase in strength over what is currently possible with 3D printed parts. The new ODS-MEA composition may find applications where ODS alloys are currently used (e.g., those involving extreme thermal environments). Applications may also include areas where such properties are desirable but the resource-intensive nature and/or inability to produce highly complex geometries via conventional processes ultimately renders their use uneconomical or infeasible. Such uses include gas turbine components (for which increasing inlet temperature enables improved efficiency) for power generation, propulsion (rockets, jet engines, etc.), industrial processes, nuclear energy applications, and sample preparation equipment in the mining and cement production industries, among many others.