Robust Sensors Detect Material Ablation and Temperature Changes

The thin film sensor’s principal advantage lies in its potential to take high frequency temperature measurements from the surface of a reentering spacecraft while simultaneously withstanding the high temperature and oxidizing environment encountered. This data provides engineers with operational phase measurements used to refine the spacecraft’s operational envelope and track flight hardware behavior in addition to providing high frequency temperature measurements that can inform the physics of a boundary layer. Mismatches in coefficients of thermal expansion (CTE) are expected in TPS-based sensor applications because the metallic materials used for temperature sensing have thermal expansion rates that differ from the rates of the substrate and coating materials in the TPS. At high temperatures during reentry, this mismatch in CTE can create a significant strain differential between the metallic sensor, sensor leads, and the materials to which the sensor and leads are bonded. High frequency response temperature measurements on the surface of entry spacecraft are not currently possible above ~700 F with existing measurement capabilities. This shortcoming is primarily due to the need for robust sensor behavior at temperatures of several thousand degrees F. The sensor design of this technology preserves the integrity of sensor components while enhancing its high temperature functionality. The thin film temperature sensor has a technology readiness level (TRL) 5 (Component and/or breadboard validation in relevant environment) and is now available for patent licensing. Please note that NASA does not manufacture products itself for commercial sale.

Conventional ambient-temperature oxygen sensors are limited in various ways: optically based sensors can be expensive and challenging to manufacture; electrochemical cells with liquid electrolytes can have limited lifetimes and become leak sources; and both types of sensors are difficult to miniaturize. These problems are addressed with Glenn's novel ambient temperature oxygen microsensor, which is based on a Nafiontm polymer electrolyte, microfabricated using thin-film technologies. In the past, one drawback of Nafiontm film has been that it can lose conductivity when the moisture content in the film is too low, potentially affecting sensor operation. Glenn researchers devised a method to use certain salts to hold water molecules in the Nafiontm film structure at room temperature. The presence of these salts provides extra sites in the film to promote proton (H+) mobility, thus improving film conductivity and overall sensor performance, particularly in arid and high-temperature environments. The innovative use of metal/metal oxide as the reference electrode enables miniaturization by eliminating the reference gas and sealing the reference electrode. The combination of interdigitized electrodes with the unique metal/metal oxide reference electrode permits sensor operation in either potentiometric or amperometric mode, as appropriate. In potentiometric mode, which measures voltage differences between working and reference electrodes in different gases, the voltage differences can be monitored with a voltmeter; however, the sensor itself does not need a power source. In room-temperature testing, the sensor achieved repeatable responses to 21 percent oxygen in nitrogen (using nitrogen as a baseline gas), and also detected oxygen from 7 to 21 percent, making Glenn's breakthrough technology usable for personal health monitoring as well as fire detection, fuel-leak detection, and environmental monitoring.

This technology is a new sensor made up of dielectric materials tuned to accurately measure a variable and wide range of temperatures. The sensor is wireless and is powered by an external magnetic field. As the temperature changes, the dielectric material changes its signature magnetic response and the change is detected by a magnetic field response sensor. Applications for this technology are temperature sensors for non-conductive surfaces where the conditions or operations require a robust and wireless sensor.

Prior approaches to bonding a SiC sensor and a SiC cover member relied on either electrostatic bonding or direct bonding using glass frits. The problem with the former is that its relatively weak bond strength may lead to debonding during thermal cycling, while the latter requires the creation of apertures that can allow sealant to leak. Glenn's innovation uses NASA's microelectromechanical system direct chip attach (MEMS-DCA) technology that can be bulk-manufactured to reduce sensor costs. The MEMS-DCA process allows a direct connection to be made between chip and pins, thereby eliminating wire bonding. Sensors and electronics are attached in a single-stage process to a multifunctional package, which, unlike previous systems, can be directly inserted into the housing. Additional thick pins within the electrical outlet allow the package to be connected to external circuitry. Furthermore, because the top and bottom substrates' thermomechanical properties are similar to that of the sensors, the problem of mismatch in the coefficient of thermal expansion is significantly reduced, minimizing thermal cycling and component fatigue. By protecting sensors and electronics in temperatures up to 600°C, approximately twice what has previously been achievable, Glenn's innovation enables SiC components to realize one of their most exciting possibilities - direct placement within high-temperature environments.

How It Works The scanners operation is based on the principle of Laser Triagulation. The ShuttleSCAN contains an imaging sensor; two lasers mounted on opposite sides of the imaging sensor; and a customized, on-board processor for processing the data from the imaging sensor. The lasers are oriented at a given angle and surface height based on the size of objects being examined. For inspecting small details, such as defects in space shuttle tiles, a scanner is positioned close to the surface. This creates a small field of view but with very high resolution. For scanning larger objects, such as use in a robotic vision application, a scanner can be positioned several feet above the surface. This increases the field of view but results in slightly lower resolution. The laser projects a line on the surface, directly below the imaging sensor. For a perfectly flat surface, this projected line will be straight. As the ShuttleSCAN head moves over the surface, defects or irregularities above and below the surface will cause the line to deviate from perfectly straight. The SPACE processors proprietary algorithms interpret these deviations in real time and build a representation of the defect that is then transmitted to an attached PC for triangulation and 3-D display or printing. Real-time volume calculation of the defect is a capability unique to the ShuttleSCAN system. Why It Is Better The benefits of the ShuttleSCAN 3-D system are very unique in the industry. No other 3-D scanner can offer the combination of speed, resolution, size, power efficiency, and versatility. In addition, ShuttleSCAN can be used as a wireless instrument, unencumbered by cables. Traditional scanning systems make a tradeoff between resolution and speed. ShuttleSCANs onboard SPACE processor eliminates this tradeoff. The system scans at speeds greater than 600,000 points per second, with a resolution smaller than .001". Results of the scan are available in real time, whereas conventional systems scan over the surface, analyze the scanned data, and display the results long after the scan is complete.