High Flow Differential Cleaning

The following methods can be used individually or in combination to generate superhydrophobic surfaces: Synthesis of novel copolyimide oxetanes with unique surface properties The technology is the synthesis of a polyimide coating or film with a modified surface chemistry shown in Figure 1. A minor amount of an oxetane reactant containing fluorine is added to the polyimide, and the oxetane preferentially migrates to the surface, enabling relatively high concentrations of fluorine at the surface, without compromising the functional performance of the bulk of the polymide coating/film. The copolymers exhibit mitigation of particle adhesion and fouling from exposure to various particulate and biological contaminants and exhibit reduced surface energy and increased surface fluorine content at extremely low oxetane loadings relative to the imide matrix (see Figure 2). Additionally, the short fluorinated carbon chains do not bioaccumulate, reducing the environmental impact of these materials. Modifying surface energy via laser ablative surface patterning This method uses a laser to create nanoscale patterns in the surface of a material to increase the hydrophobicity of the surface (see Figure 2). The benefits of hydrophobic surfaces include decreases in friction and increases in self-cleaning properties. This is an advantageous method of surface modification because it is fast and single-step, promises to be scalable, requires no chemicals, could be applied to a variety of materials, and does not require a planar surface for patterning.

PCBs have been shown to cause cancer in animals and to have other adverse effects on immune, reproductive, nervous, and endocrine systems. Although the production of PCBs in the United States has been banned since the late 1970s, many surfaces are still coated with PCB-laden paints. The presence of PCBs in paints adds complexity and expense for disposal. Some treatment methods (e.g., use of solvents, physical removal via scraping) are capable of removing PCBs from surfaces, but these technologies create a new waste stream that must be treated. Other methods, like incineration, can destroy the PCBs but destroy the painted structure as well, preventing reuse. To address limitations with traditional abatement methods for PCBs in paints, researchers at NASAs Kennedy Space Center (KSC) and the University of Central Florida have developed the Activated Metal Treatment System (AMTS) for Paints. This innovative technology consists of a solvent solution (e.g., ethanol, d-limonene) that contains an activated zero-valent metal. AMTS is first applied to the painted surface either using spray-on techniques or wipe-on techniques. The solution then extracts the PCBs from the paint. The extracted PCBs react with the microscale activated metal and are degraded into benign by-products. This technology can be applied without removing the paint or dismantling the painted structure. In addition, the surface can be reused following treatment.

This NASA innovation is a method for quantifying and improving accuracy of X-Ray CT-based metal AM part inspection by comparing X-Ray CT data with a high-fidelity 2D surface imaging technique such as surface profilometry. Using surface profilometry that has a NIST-traceable calibration, the technique guarantees a specific level of high fidelity, allowing surface profilometry data to serve as a ground truth reference with which to judge X-Ray CT accuracy and detectability. To deploy the method, both 3D X-Ray CT data and 2D high-fidelity surface images are acquired on the same metal AM part. 3D X-Ray CT data is then segmented and reoriented to extract a 2D X-Ray CT surface image. Measurements of features (e.g., surface-breaking porosity) are then made in both datasets, followed by a comparison of various metrics. This comparison serves two purposes: (a) quantifying the accuracy of the X-Ray CT inspection performed, and (b) providing an objective function which can be minimized to optimize X-Ray CT inspection. The objective function allows engineers to tune X-Ray CT parameters to minimize the function. These optimized parameters can then be implemented to achieve higher accuracy and defect detection reliability in X-Ray CT imaging. Once an X-Ray CT process is optimized for a specific metal AM component, analysis and certification can be accelerated. This technology helps develop X-Ray CT-based metal AM part inspection processes with high accuracy and reliable detectability. Industries for which metal AM parts are desirable and safety, reliability, and fatigue life is of concern (e.g., aerospace, commercial space, automotive, medical) could benefit from the invention. Companies including X-Ray CT inspection system manufacturers using optical sensors and software, NDE data analysis software providers, and end-users in the industries may be interested in licensing this NASA invention.

In addition to previous LOTUS coating formulations, an additional optical formulation may be applied via vacuum deposition. This coating forms a top layer and may be applied in different thicknesses that serve to enhance its hydrophobic properties. The vacuum deposited material may comprise fluorinated ethylene propylene or a similar material. This coating is transparent and can be used on optical components or any other applications requiring a clear coating.

The technology is an innovative process for creating metal-patterned, structured membranes for micromachining applications. The method uses potassium hydroxide to remove silicon, in combination with XHRiC. Hafnium metal is first patterned onto a silicon nitride wafer, which serves as the starting substrate. XHRiC is then applied to the wafer, followed by patterning with photoresist and etching using O2 plasma to define cut slots in the membrane. The photoresist is then removed. Next, the wafer is bonded to a Pyrex carrier wafer with wax, and the backside of the silicon nitride is patterned and reactive-ion etched. The wafer is then placed in hot potassium hydroxide for 16 hours to remove the silicon layer, creating a silicon nitride membrane. The wafer is subsequently placed in acetone to dissolve the wax. The wafer is resecured to the Pyrex carrier wafer, and the topside of the silicon nitride membrane is subjected to reactive-ion etching. Finally, the XHRiC layer is removed using O2 plasma, and the Pyrex handle wafer is released, resulting in a metal-patterned silicon nitride membrane with cut slots. This novel process supports the creation of structured membranes with a wide range of applications in MEMS fabrication. The use of XHRiC as a patterned hard mask and/or etch protection material enables its application in various MEMS devices. The process can be used to fabricate cut membranes, micro/nano structures, and ultra-thin films for device applications, making it an excellent candidate for MEMS foundry companies and accelerometer manufacturers. It has reached a Technology Readiness Level (TRL) 5 (component validation in a relevant environment) and is now available for patent licensing.