Advanced Hydrogen and Hydrocarbon Gas Sensors

Prior approaches to bonding a SiC sensor and a SiC cover member relied on either electrostatic bonding or direct bonding using glass frits. The problem with the former is that its relatively weak bond strength may lead to debonding during thermal cycling, while the latter requires the creation of apertures that can allow sealant to leak. Glenn's innovation uses NASA's microelectromechanical system direct chip attach (MEMS-DCA) technology that can be bulk-manufactured to reduce sensor costs. The MEMS-DCA process allows a direct connection to be made between chip and pins, thereby eliminating wire bonding. Sensors and electronics are attached in a single-stage process to a multifunctional package, which, unlike previous systems, can be directly inserted into the housing. Additional thick pins within the electrical outlet allow the package to be connected to external circuitry. Furthermore, because the top and bottom substrates' thermomechanical properties are similar to that of the sensors, the problem of mismatch in the coefficient of thermal expansion is significantly reduced, minimizing thermal cycling and component fatigue. By protecting sensors and electronics in temperatures up to 600°C, approximately twice what has previously been achievable, Glenn's innovation enables SiC components to realize one of their most exciting possibilities - direct placement within high-temperature environments.

Conventional ambient-temperature oxygen sensors are limited in various ways: optically based sensors can be expensive and challenging to manufacture; electrochemical cells with liquid electrolytes can have limited lifetimes and become leak sources; and both types of sensors are difficult to miniaturize. These problems are addressed with Glenn's novel ambient temperature oxygen microsensor, which is based on a Nafiontm polymer electrolyte, microfabricated using thin-film technologies. In the past, one drawback of Nafiontm film has been that it can lose conductivity when the moisture content in the film is too low, potentially affecting sensor operation. Glenn researchers devised a method to use certain salts to hold water molecules in the Nafiontm film structure at room temperature. The presence of these salts provides extra sites in the film to promote proton (H+) mobility, thus improving film conductivity and overall sensor performance, particularly in arid and high-temperature environments. The innovative use of metal/metal oxide as the reference electrode enables miniaturization by eliminating the reference gas and sealing the reference electrode. The combination of interdigitized electrodes with the unique metal/metal oxide reference electrode permits sensor operation in either potentiometric or amperometric mode, as appropriate. In potentiometric mode, which measures voltage differences between working and reference electrodes in different gases, the voltage differences can be monitored with a voltmeter; however, the sensor itself does not need a power source. In room-temperature testing, the sensor achieved repeatable responses to 21 percent oxygen in nitrogen (using nitrogen as a baseline gas), and also detected oxygen from 7 to 21 percent, making Glenn's breakthrough technology usable for personal health monitoring as well as fire detection, fuel-leak detection, and environmental monitoring.

A team of NASA Glenn researchers has developed a portfolio of SiC-enabled electronics and sensors. SiC's ability to function in harsh environments&#8212high-temperature, high-power, high radiation&#8212enables much better performance in many combustion applications. Building on their successful and miniaturized SiC pressure sensor package, the team added a resistance temperature detector (RTD) to the same chip. Having both sensors on a single SiC substrate facilitates the simultaneous measurement of pressure and temperature. The integrated P/T sensors are fabricated with a prescribed sequence of photo lithography and reactive ion etching fabrication steps to create patterns and structures and deposit RTD elements and other layers. Designed to monitor jet engine health, this P/T sensor can be placed directly on the engine, close to the combustion source, for highly accurate, real-time data analysis. As shown in the figures below, the sensor has been tested and characterized for long-term high-temperature stability and response. The data prove that the sensor’s performance is repeatable, with negligible hysteresis. Compared to conventional silicon piezoresistive sensors, this new sensor is more viable in high-temperature environments.

Glenn's breakthrough technology introduces batch-fabricated, miniature sensors embedded and distributed over a large surface area of a material or product during the manufacturing process. The sensors can be utilized for test instrumentation or as an integrated in-situ monitoring system. This integrated manufacturing approach preserves the structural and mechanical system integrity by eliminating the antiquated plug-in approach, invasive machining, manual insertion, and gluing processes currently required to implant sensors into a material. The sensor ladder network of resistors and capacitors breaks down as result of the thermo-physical effects caused by temperature, shock, radiation, corrosion, or other reactions, causing a change in the electrical properties. A processor interprets these changes in the electrical properties and generates a high-resolution, large-area surface profile. The profile demonstrates the amount or rate of material deterioration and temperature change, and is used to optimize geometric structural design, develop materials, predict performance, and make decisions. These sensors play an important role as industries work to realize material performance and product design. This type of monitoring is ideal for infrastructures, nuclear enclosures, or any system susceptible to surface deterioration.

Current bulk or thick film solid electrolyte CO2 sensors are expensive, difficult to batch fabricate, and large in size. In contrast, this new amperometric, solid-state, oxide-based electrolyte CO2 microsensor is affordable, easy to fabricate, and is so small that it could easily be integrated onto a substrate the size of a postage stamp. The basic composition of the sensor is identical to a previously designed NASA Glenn technology in which a solid electrolyte of Na3Zr2Si2PO12 is deposited between interdigitated electrodes on an alumina substrate and is covered by Na2CO3/BaCO3. Unlike its predecessor, however, this innovation includes an additional layer of nanocrystalline SnO2 sol gel, an electron donor type (N-type) semiconductor, on top of the Na2CO3/BaCO3 . This new layer provides a greater number of electrons for reduction reaction at the working electrode to detect CO2. As a result, overall performance is enhanced, and this new state-of-the-art sensor has the ability to operate at temperatures as low as 375°C. This low temperature capability significantly decreases the amount of power required to operate the sensor, opening the door to a multitude of new applications that were previously unattainable.