SiC-Based Microstructures for Sensors

Glenn's invention is game-changing in its ability to produce ultra-thin SiC-based microstructures and diaphragms that are essential for high-sensitivity pressure sensors that not only monitor engines but can also act as biosensors (monitoring bone density or brain pressure). DSRIE offers selective etching that reliably isolates conductive microstructures from the bulk material and has precision-etch control that minimizes yield loss due to manufacturing defects. Therefore, the thickness of structures, such as diaphragms, can be ultra-thin and selectively realized during dopant reactive ion etching. The ultra-thin diaphragm is a key enabler for Glenn's novel pressure sensor that can measure at low pressures in the sub-psi range. Until now, batch fabrication of SiC sensors has been hindered by the fact that only one type of sensor per wafer could be produced at a time. Given the expense of fabrication, this limitation has greatly reduced the commercial viability of SiC sensors and electronics. Glenn's batch fabrication offers manufacturers the opportunity to simultaneously produce multiple multifunctional MEMS/NEMS products on a single SiC wafer. Such products include flow sensors, pressure sensors, biosensors, accelerometers, inertial sensors, angular rate sensors, and yaw rate sensors. By simplifying production, reducing capital equipment, and lowering production costs, Glenn's novel process makes the use of SiC-based MEMS/NEMS in sensors and electronics much more practical and attainable for countless industries.