X-Ray Crack Detectability

This technology is a method of using x-ray diffraction (XRD) to evaluate the concentration of crystal structure defects, and thus the quality, of cubic (100)-oriented semiconductor wafers. Developed to enhance NASA's capabilities in fabricating chips for aeronautics applications, the method supplants existing methods that not only destroy the wafer in question, but can take as long as a day to determine the quality of a single wafer. The approach can be used with any commonly used semiconductor, including silicon, SiGe, GaAs and others, in a cubic (100) orientation, which covers at least 90% of commercial wafers. It can also be used to evaluate the quality of epi layers deposited on wafer substrates, and of ingots before they are sliced into wafers.

This NASA innovation is a method for quantifying and improving accuracy of X-Ray CT-based metal AM part inspection by comparing X-Ray CT data with a high-fidelity 2D surface imaging technique such as surface profilometry. Using surface profilometry that has a NIST-traceable calibration, the technique guarantees a specific level of high fidelity, allowing surface profilometry data to serve as a ground truth reference with which to judge X-Ray CT accuracy and detectability. To deploy the method, both 3D X-Ray CT data and 2D high-fidelity surface images are acquired on the same metal AM part. 3D X-Ray CT data is then segmented and reoriented to extract a 2D X-Ray CT surface image. Measurements of features (e.g., surface-breaking porosity) are then made in both datasets, followed by a comparison of various metrics. This comparison serves two purposes: (a) quantifying the accuracy of the X-Ray CT inspection performed, and (b) providing an objective function which can be minimized to optimize X-Ray CT inspection. The objective function allows engineers to tune X-Ray CT parameters to minimize the function. These optimized parameters can then be implemented to achieve higher accuracy and defect detection reliability in X-Ray CT imaging. Once an X-Ray CT process is optimized for a specific metal AM component, analysis and certification can be accelerated. This technology helps develop X-Ray CT-based metal AM part inspection processes with high accuracy and reliable detectability. Industries for which metal AM parts are desirable and safety, reliability, and fatigue life is of concern (e.g., aerospace, commercial space, automotive, medical) could benefit from the invention. Companies including X-Ray CT inspection system manufacturers using optical sensors and software, NDE data analysis software providers, and end-users in the industries may be interested in licensing this NASA invention.

The Damage Detection System consists of layered composite material made up of two-dimensional thin film damage detection layers separated by thicker, nondetection layers, coupled with a detection system. The damage detection layers within the composite material are thin films with a conductive grid or striped pattern. The conductive pattern can be applied on a variety of substrates using several different application methods. The number of detection layers in the composite material can be tailored depending on the level of damage detection detail needed for a particular application. When damage occurs to any detection layer, a change in the electrical properties of that layer is detected and reported. Multiple damages can be detected simultaneously, providing real-time detail on the depth and location of the damage. The truly unique feature of the System is its flexibility. It can be designed to gather as much (or as little) information as needed for a particular application using wireless communication. Individual detection layers can be turned on or off as necessary, and algorithms can be modified to optimize performance. The damage detection system can be used to generate both diagnostic and prognostic information related to the health of layered composite structures, which will be essential if such systems are utilized to protect human life and/or critical equipment and material.

Additive manufacturing or 3-D printing is a rapidly growing field where solid, objects can be produced layer by layer. This technology will have a significant impact in many areas including industrial manufacturing, medical, architecture, aerospace, and automotive. The advantages of additive manufacturing are reduction in material costs due to near net shape part builds, minimal machining required, computer assisted builds for rapid prototyping, and mass production capability. Traditional thermal nondestructive evaluation (NDE) techniques typically use a stationary heat source such as flash or quartz lamp heating to induce a temperature rise. The defects such as cracks, delamination damage, or voids block the heat flow and therefore cause a change in the transient heat flow response. There are drawbacks to these methods.

NASA's System for In-situ Defect (e.g., porosity, fiber waviness) Detection in Composites During Cure consists of an ultrasonic portable automated C-Scan system with an attached ultrasonic contact probe. This scanner is placed inside of an insulated vessel that protects the temperature-sensitive components of the scanner. A liquid nitrogen cooling systems keeps the interior of the vessel below 38°C. A motorized X-Y raster scanner is mounted inside an unsealed cooling container made of porous insulation boards with a cantilever scanning arm protruding out of the cooling container through a slot. The cooling container that houses the X-Y raster scanner is periodically cooled using a liquid nitrogen (LN2) delivery system. Flexible bellows in the slot opening of the box minimize heat transfer between the box and the external autoclave environment. The box and scanning arm are located on a precision cast tool plate. A thin layer of ultrasonic couplant is placed between the transducer and the tool plate. The composite parts are vacuum bagged on the other side of the tool plate and inspected. The scanning system inside of the vessel is connected to the controller outside of the autoclave. The system can provide A-scan, B-scan, and C-scan images of the composite panel at multiple times during the cure process. The in-situ system provides higher resolution data to find, characterize, and track defects during cure better than other cure monitoring techniques. In addition, this system also shows the through-thickness location of any composite manufacturing defects during cure with real-time localization and tracking. This has been demonstrated for both intentionally introduced porosity (i.e., trapped during layup) as well processing induced porosity (e.g., resulting from uneven pressure distribution on a part). The technology can be used as a non-destructive evaluation system when making composite parts in in an oven or an autoclave, including thermosets, thermoplastics, composite laminates, high-temperature resins, and ceramics.