X-Ray Diffraction Method to Detect Defects in Cubic Semiconductor (100) Wafers

manufacturing
X-Ray Diffraction Method to Detect Defects in Cubic Semiconductor (100) Wafers (LAR-TOPS-158)
Characterization method for sigma=3 twin defects in cubic semiconductor (100) wafers
Overview
NASA Langley Research Center has developed a method of using x-ray diffraction (XRD) to detect defects in cubic semiconductor (100) wafers. The technology allows non-destructive evaluation of wafer quality in a simple, fast, inexpensive process that can be easily incorporated into an existing fab line. The invention adds value throughout the semiconductor industry but is especially relevant in high end, high speed electronics where wafer quality has a more significant effect on yields.

The Technology
This technology is a method of using x-ray diffraction (XRD) to evaluate the concentration of crystal structure defects, and thus the quality, of cubic (100)-oriented semiconductor wafers. Developed to enhance NASA's capabilities in fabricating chips for aeronautics applications, the method supplants existing methods that not only destroy the wafer in question, but can take as long as a day to determine the quality of a single wafer. The approach can be used with any commonly used semiconductor, including silicon, SiGe, GaAs and others, in a cubic (100) orientation, which covers at least 90% of commercial wafers. It can also be used to evaluate the quality of epi layers deposited on wafer substrates, and of ingots before they are sliced into wafers.
Microchips (a) Pole-figure of GaAs (004), (b) Angles of twin defects with respect to the original crystal, (c) Typical material characterization method of X-ray diffraction
Benefits
  • Unlike existing methods of assessing wafer quality, the method is fast and non-destructive.
  • The technique can be easily incorporated into an existing fab line.
  • The required equipment can be purchased relatively inexpensively.
  • Training for instrument operators can be accomplished in two weeks.
  • By detecting significant wafer defect problems before circuits are fabricated, yields can be increased considerably and cost issues avoided.
  • The method can be used to detect crystal structure defects in any cubic (100) oriented semiconductor crystal, which is more than 90% of commercial wafers and includes silicon, SiGe, GaAs, InP, etc.

Applications
  • Semiconductor manufacturing
Technology Details

manufacturing
LAR-TOPS-158
LAR-18306-1
9,835,570
Similar Results
X-Ray Crack Detectability
NASAs software technology uses an Image Quality Indicator (IQI)-based model that can predict whether cracks of a certain size can be detected, as well as a model that can provide appropriate conditions to optimize x-ray crack detection setup. Because this modeling software can predict minimum crack sizes that can be detected by a particular X-ray radiography testing setup, users can test various setups until the desired crack detection capabilities are achieved (predicted) by the modeling system. These flaw size parameter models use a set of measured inputs, including thickness sensitivity, detector modulation transfer function, detector signal response function, and other setup geometry parameters, to predict the minimum crack sizes detectable by the testing setup and X-ray angle limits for detecting such flaws. Current X-ray methods provide adequate control for detection of volumetric flaws but do not provide a high probability of detection (POD), and crack detection sensitivity cannot be verified for reliable detection. This results in reduced confidence in terms of crack detection. Given that these cracks, if undetected, can cause catastrophic failure in various systems (e.g., pressure vessels, etc.), verifying that X-ray radiography systems used for NDE can detect such cracks is of the utmost importance in many applications.
First 3-D Printed Jet Engine
In-situ Characterization and Inspection of Additive Manufacturing Deposits using Transient Infrared Thermography
Additive manufacturing or 3-D printing is a rapidly growing field where solid, objects can be produced layer by layer. This technology will have a significant impact in many areas including industrial manufacturing, medical, architecture, aerospace, and automotive. The advantages of additive manufacturing are reduction in material costs due to near net shape part builds, minimal machining required, computer assisted builds for rapid prototyping, and mass production capability. Traditional thermal nondestructive evaluation (NDE) techniques typically use a stationary heat source such as flash or quartz lamp heating to induce a temperature rise. The defects such as cracks, delamination damage, or voids block the heat flow and therefore cause a change in the transient heat flow response. There are drawbacks to these methods.
Airplane Inspection
Scintillating Quantum Dots for Imaging X-rays (SQDIX) for Aircraft Inspection
The SQDIX system is an enabling technology that will have game-changing impacts across many fields including DoE, DoD, NASA, medical imaging fields, aircraft inspection and many other fields. StQDs are sensitive to x-ray radiation and emit visible photons that are tunable in wavelength. Development of this technology will greatly impact NASAs ability to use X-Rays as an inspection method. This directly addresses the Aviation Safety challenge in the 2010 National Aeronautics R&D Plan to monitor and assess the health of aircraft more efficiently and effectively as well as all NASA spaceflights beyond earths magnetic field.
While Sochi is a coastal town on the Black Sea, the skiing events for the XXII Olympic Games are taking place about 40 kilometers (25 miles) inland. The venues are clustered around Krasnaya Polyana, a small town tucked between the Aibiga and Psekhako Ridges in the western Caucasus. This imageacquired by the Advanced Land Imager (ALI) on NASAs Earth Observing-1 (EO-1) satellite on February 8, 2014offers a view of the town and the ski facilities. The Rosa Khutor Alpine Center is the home to the downhill, snowboard, and freestyle events. The combined downhill skiing area measures about 20 kilometers (12 miles) in total, with the mens downhill course stretching 3,500 meters (11,482 feet) and featuring a 1,075-meter (3,526 foot) change in elevation. The highest lift climbs to the summit of Rosa Peak, which rises 2,320 meters (7,612 feet). While not being used for the Olympics, the nearby Black Pyramid mountain has downhill skiing trails as well. The same steep slopes that make Rosa Peak good for skiing also elevate the risk of avalanches. To protect against falling snow, planners installed a series of gas pipes along the top of the ridge. The pipes emit bursts of oxygen and propane that create small, controlled avalanches. Event organizers also installed a series of earthen dams to steer snow away from infrastructure, and they have deployed two backhoes to the top of Aibiga Ridge to knock cornices away before they pose a risk. The Laura Cross-country Ski and Biathalon Center is located to the north on Psekhako Ridge. It includes two stadiums, each with their own start and finish zones, two track systems for skiing and biathlon, as well as shooting areas and warm-up zones. The center is named for the Laura River, a turbulent river that flows nearby. NASA Earth Observatory image by Jesse Allen and Robert Simmon, using EO-1 ALI data provided courtesy of the NASA EO-1 team. Caption by Adam Voiland.
Pyramid Image Quality Indicator
The Pyramid Image Quality Indicator is based on the shape of a tall, 4-sided pyramid. Each side of the pyramid has a pair of vertical trenches which draw closer to each other and get narrower as they approach the tip of the pyramid. Inside the pyramid is a hollowed out conical section which may contain internal features for determining resolution or inserts that can be used for measuring contrast sensitivity. The system can be economically 3D printed and then coated, if need be, with high x-ray absorbing material. When a CT system operator is scanning a part, a specific method for that part which might include a large number of variables such as x-ray voltage, detector-to-source spacing, pixel size, etc. This established method will result in an effective level of detail for the resulting scan. The IQI is used to measure that level of detail. The operator may follow up the scan of the part with an identical scan of the IQI, which will allow a realistic measurement of parameters, like effective resolution or contrast sensitivity. The interior of the Pyramid IQI uses a 3D variant suited for 3D CT scan data tools, known as penetrameters. These penetrameters are a solid disc of material. A stack of discs of different diameters would accommodate a range of different thicknesses. The Pyramid IQI can be easily scaled for either larger or smaller parts. It can also be 3D printed using either plastic or metal additive manufacturing. This allows an end-user to match the material density of the IQI to that of the actual part.
System for In-situ Defect Detection in Composites During Cure
NASA's System for In-situ Defect (e.g., porosity, fiber waviness) Detection in Composites During Cure consists of an ultrasonic portable automated C-Scan system with an attached ultrasonic contact probe. This scanner is placed inside of an insulated vessel that protects the temperature-sensitive components of the scanner. A liquid nitrogen cooling systems keeps the interior of the vessel below 38°C. A motorized X-Y raster scanner is mounted inside an unsealed cooling container made of porous insulation boards with a cantilever scanning arm protruding out of the cooling container through a slot. The cooling container that houses the X-Y raster scanner is periodically cooled using a liquid nitrogen (LN2) delivery system. Flexible bellows in the slot opening of the box minimize heat transfer between the box and the external autoclave environment. The box and scanning arm are located on a precision cast tool plate. A thin layer of ultrasonic couplant is placed between the transducer and the tool plate. The composite parts are vacuum bagged on the other side of the tool plate and inspected. The scanning system inside of the vessel is connected to the controller outside of the autoclave. The system can provide A-scan, B-scan, and C-scan images of the composite panel at multiple times during the cure process. The in-situ system provides higher resolution data to find, characterize, and track defects during cure better than other cure monitoring techniques. In addition, this system also shows the through-thickness location of any composite manufacturing defects during cure with real-time localization and tracking. This has been demonstrated for both intentionally introduced porosity (i.e., trapped during layup) as well processing induced porosity (e.g., resulting from uneven pressure distribution on a part). The technology can be used as a non-destructive evaluation system when making composite parts in in an oven or an autoclave, including thermosets, thermoplastics, composite laminates, high-temperature resins, and ceramics.
Stay up to date, follow NASA's Technology Transfer Program on:
facebook twitter linkedin youtube
Facebook Logo Twitter Logo Linkedin Logo Youtube Logo